About us
Partow Technologies is a provider of advanced technologies based on thin film lithium niobate (TFLN) technology. The company provides room temperature wafer bonding tools (based on atomic fusion) that can be used for fabrication of TFLN substrates as well as many other applications in electronics. The company also provides TFLN substrates and devices. We are developing TFLN based emitters and receivers.
News
- Partow’s EO Sensor Enables Breakthrough Accelerator Sensor Technology at Argonne Facility (ANL)
- New Paper on TFLN based THz wave detector
- New Paper on TFLN based EO electric field sensors
- We’re excited to announce that our latest U.S. patent, “Electro-optic electric field sensor and method of fabrication”, has been officially granted.
Patent No.: US 11,815,747 - Partow received SBIR phase I award to develop Electro-optic sensors for non-destructive electron beam diagnostics for DOE
- Partow received STTR phase II award to develop UHV room-temperature wafer bonding system for DOD.
- Partow will be in Photonics West 2026, January 20-22 in San Fransisco. Booth 2367
- Join Partow at SEMICON West 2025, October 7–9 in Phoenix, Arizona, at booth #5482